发明名称 |
Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument |
摘要 |
A method of manufacturing a semiconductor device includes: forming a protective film including an opening on a wiring board having an interconnect pattern so that the protective film has an uneven surface and a part of the interconnect pattern is exposed in the opening; and mounting a semiconductor chip including an electrode on the wiring board so that the part of the interconnect pattern exposed in the opening faces and is electrically connected with the electrode. The protective film is formed so that a recess of the uneven surface does not pierce the protective film.
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申请公布号 |
US2005095746(A1) |
申请公布日期 |
2005.05.05 |
申请号 |
US20040941871 |
申请日期 |
2004.09.16 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
AOYAGI AKIYOSHI |
分类号 |
H01L21/60;H01L21/00;H01L21/44;H01L21/56;H01L23/498;(IPC1-7):H01L21/44 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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