发明名称 |
Bonding pad structure |
摘要 |
A substrate has a bonding region and a sensing region. A first dielectric layer is formed overlying the substrate and has a dielectric island surrounded by a ring-shaped trench. A first conductive layer is formed in the ring-shaped trench of the first dielectric layer. A passivation layer is formed overlying the first dielectric layer and has an opening, in which the opening corresponds to the bonding region and the sensing region and exposes the dielectric island and a part of the first conductive layer. A second conductive layer covers the opening of the passivation layer and is electrically connected to the first conductive layer.
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申请公布号 |
US2005093176(A1) |
申请公布日期 |
2005.05.05 |
申请号 |
US20030696186 |
申请日期 |
2003.10.29 |
申请人 |
HUNG MENG-CHI;HOU SHANG-YUNG;JENG SHIN-PUU |
发明人 |
HUNG MENG-CHI;HOU SHANG-YUNG;JENG SHIN-PUU |
分类号 |
H01L23/485;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/485 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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