发明名称 Electronic device and module structure thereof
摘要 An electronic device. The electronic device comprising a host, and a module structure is disposed in the host for calculating data. The module structure has a first substrate, a process unit, a heat-dissipating device and a second substrate. The first substrate is a motherboard of the electronic device, and the process unit is disposed on the first substrate, and the heat-dissipating device is attached to the process unit and disposed on the first substrate. The first substrate and the second substrate have the same structure and texture. The first substrate and the second substrate are blanketed from a multi-layer structure or sheet used for the motherboard.
申请公布号 US2005094372(A1) 申请公布日期 2005.05.05
申请号 US20040792332 申请日期 2004.03.03
申请人 LAI CHIH-HSI 发明人 LAI CHIH-HSI
分类号 G06F1/20;H01L23/40;(IPC1-7):G06F1/20 主分类号 G06F1/20
代理机构 代理人
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