发明名称 |
Integrated spin valve head |
摘要 |
Currently, the shield-to-shield separation of a spin valve head cannot be below about 800 Å, mainly due to sensor-to-lead shorting problems. This problem has now been overcome by inserting a high permeability, high resistivity, thin film shield on the top or bottom (or both) sides of the spin valve sensor. A permeability greater than about 500 is required together with a resistivity about 5 times greater than that of the free layer and an M<SUB>r</SUB>T value for the thin film shield that is 4 times greater than that of the free layer. Five embodiments of the invention are described.
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申请公布号 |
US2005094324(A1) |
申请公布日期 |
2005.05.05 |
申请号 |
US20040011995 |
申请日期 |
2004.12.14 |
申请人 |
HEADWAY TECHNOLOGIES, INC. |
发明人 |
JU KOCHAN;HORNG CHENG T.;ZHENG YOUFENG;LIAO SIMON;CHANG JEI-WEI |
分类号 |
G01R33/09;B05D7/00;G11B5/127;G11B5/187;G11B5/29;G11B5/31;G11B5/33;G11B5/39;H01F10/16;H01F10/30;H01F10/32;H01L43/08;H01L43/12;H04R31/00;(IPC1-7):G11B5/33 |
主分类号 |
G01R33/09 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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