发明名称 Integrated spin valve head
摘要 Currently, the shield-to-shield separation of a spin valve head cannot be below about 800 Å, mainly due to sensor-to-lead shorting problems. This problem has now been overcome by inserting a high permeability, high resistivity, thin film shield on the top or bottom (or both) sides of the spin valve sensor. A permeability greater than about 500 is required together with a resistivity about 5 times greater than that of the free layer and an M<SUB>r</SUB>T value for the thin film shield that is 4 times greater than that of the free layer. Five embodiments of the invention are described.
申请公布号 US2005094324(A1) 申请公布日期 2005.05.05
申请号 US20040011995 申请日期 2004.12.14
申请人 HEADWAY TECHNOLOGIES, INC. 发明人 JU KOCHAN;HORNG CHENG T.;ZHENG YOUFENG;LIAO SIMON;CHANG JEI-WEI
分类号 G01R33/09;B05D7/00;G11B5/127;G11B5/187;G11B5/29;G11B5/31;G11B5/33;G11B5/39;H01F10/16;H01F10/30;H01F10/32;H01L43/08;H01L43/12;H04R31/00;(IPC1-7):G11B5/33 主分类号 G01R33/09
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