发明名称 Two-piece magnetic shield having improved heat dissipation
摘要 Problems such as thermal pole tip protrusion result from thermal mismatch between the alumina and pole material during the writing process. This, and similar problems due to inadequate heat dissipation, have been overcome by dividing the bottom shield into two pieces both of which sit on top of a non-magnetic heat sink. Heat generated by the coil during writing is transferred to the non-magnetic heat sink whence it gets transferred to the substrate. With this approach, the head not only benefits from less field disturbance due to the small shield but also improves heat dissipation from the additional heat sink
申请公布号 US2005094319(A1) 申请公布日期 2005.05.05
申请号 US20030696431 申请日期 2003.10.29
申请人 HEADWAY TECHNOLOGIES, INC. 发明人 HAN CHERNG-CHYI;LEE ROD;CHEN MAO-MIN;WANG POKANG
分类号 G11B5/127;G11B5/31;G11B5/33;(IPC1-7):G11B5/33 主分类号 G11B5/127
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