System and method for defect free conductor deposition on substrates

摘要

A system and method for depositing a defect-free conductor on semiconductor substrates having features and seed layers with defective regions. A repair layer is deposited over the seed layer and the defective regions in a deposition module within a housing. The repair layer can be deposited by atomic layer deposition or chemical vapor deposition. A conductive material is then electroplated over the seed layer to fill the features and form a defect-free conductive layer over the top surface of the substrate. The electroplating is performed in another deposition module within the housing.