发明名称 Plasma processing apparatus and method and apparatus for measuring DC potential
摘要 In a plasma processing apparatus, a member for propagating high frequency from a high frequency power supply and/or to which the high frequency is applied. A power feed rod is electromagnetically shielded between a matching unit and a bottom plate of a chamber by a coaxial cylindrical conductor connected to a ground potential. A surface potential system disposed in an appropriate distance from the power feed rod in radius direction is installed in the cylindrical conductor, and measures in a non-contact state the electrostatic surface potential of the power feed rod through electrostatic capacitance and provides a controller with a surface potential detection signal including surface potential measurement value information. The controller performs a required signal processing or operation processing on the basis of the surface potential detection signal from the surface potential system, thereby obtaining the measurement value of the DC potential on the power feed rod.
申请公布号 US2005095732(A1) 申请公布日期 2005.05.05
申请号 US20040933422 申请日期 2004.09.03
申请人 TOKYO ELECTRON LIMITED 发明人 MAEBASHI SATOSHI;HAYAMI TOSHIHIRO;UMEHARA NAOYUKI
分类号 H05H1/00;H01J37/32;H01L21/3065;H01L21/66;H05H1/46;(IPC1-7):H01L21/66 主分类号 H05H1/00
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