发明名称 Method and apparatus for two-part CMP retaining ring
摘要 A two piece retaining ring used for chemical mechanical polishing of semiconductor substrates comprising a relatively rigid upper portion and a less rigid lower portion. The two pieces of the ring are secured to each other by snapping a central channel and extending arms over a central neck extension of the upper part.
申请公布号 US2005095964(A1) 申请公布日期 2005.05.05
申请号 US20040964310 申请日期 2004.10.12
申请人 HENGEL RAYMOND J.JR. 发明人 HENGEL RAYMOND J.JR.
分类号 B24B37/04;B24B41/06;(IPC1-7):B24B5/00 主分类号 B24B37/04
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