发明名称 CALIBRATION WAFER AND KIT
摘要 A calibration wafer which is suitable for calibrating alignment of a transfer robot blade with respect to wafers in a loadlock chamber or input shuttle. The calibration wafer includes a circular wafer body on which is provided a pair of spaced-apart blade alignment lines which are used to properly align the transfer robot blade. The invention further includes a calibration kit for calibrating alignment of a polishing head with a pedestal, including a base plate for placement on the pedestal; a calibration plate for placement on the base plate; and a calibration circle provided on the calibration plate for aligning the polishing head with the pedestal.
申请公布号 US2005091863(A1) 申请公布日期 2005.05.05
申请号 US20030701805 申请日期 2003.11.04
申请人 TAIWAN SEMICONDUCTOR MANUFACTURING CO. LTD. 发明人 CHUANG CHIH-NAN;HU TIEN-CHEN;LIN TRO-HSU;CHANG CHENG-FANG
分类号 B24B37/04;B24B47/22;G01D21/00;H01L21/302;H01L21/66;H01L21/68;H01L23/544;(IPC1-7):G01D21/00 主分类号 B24B37/04
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