发明名称 ITO film contact structure, TFT substrate and manufacture thereof
摘要 A conductive film made of Al or alloy containing Al as a main component is formed on an underlying substrate. An upper conductive film is disposed on the conductive film. A first opening is formed through the upper conductive film. An insulating film is disposed on the upper conductive film. A second opening is formed through the insulating film. An inner wall of the second opening is retreated from an inner wall of the first opening. An ITO film is formed covering a partial upper surface of the insulating film and inner surfaces of the first and second openings, and contacting a partial upper surface of the upper conductive film at a region inside of the second opening. Good electrical contact between an Al or Al alloy film and an ITO film can be established and productivity can be improved.
申请公布号 US2005092999(A1) 申请公布日期 2005.05.05
申请号 US20040999405 申请日期 2004.11.30
申请人 FUJITSU DISPLAY TECHNOLOGIES CORPORATION 发明人 FUJIKAWA TETSUYA;SUKENORI HIDETOSHI;HAYASHI SHOUGO;TANAKA YOSHINORI;KIHARA MASAHIRO
分类号 H01L29/786;H01L21/77;H01L21/84;H01L27/12;H01L29/45;(IPC1-7):H01L21/84;H01L29/10 主分类号 H01L29/786
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