发明名称 Production of a layer-like component comprises providing a substrate with a sacrificial layer before producing the component and removing the component from the substrate by selectively removing the sacrificial layer
摘要 <p>Production of a layer-like component (16) comprises providing a substrate (12) with a sacrificial layer (12a) before producing the component and removing the component from the substrate by selectively removing the sacrificial layer. An independent claim is also included for a separating device for a component arranged on a substrate.</p>
申请公布号 DE10346362(A1) 申请公布日期 2005.05.04
申请号 DE2003146362 申请日期 2003.09.30
申请人 SIEMENS AG 发明人 HANSEN, CHRISTIAN;KRUEGER, URSUS;PYRITZ, UWE
分类号 B32B38/10;B32B43/00;H01L39/24;(IPC1-7):H01L39/24;H01L31/18 主分类号 B32B38/10
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