发明名称 |
Production of a layer-like component comprises providing a substrate with a sacrificial layer before producing the component and removing the component from the substrate by selectively removing the sacrificial layer |
摘要 |
<p>Production of a layer-like component (16) comprises providing a substrate (12) with a sacrificial layer (12a) before producing the component and removing the component from the substrate by selectively removing the sacrificial layer. An independent claim is also included for a separating device for a component arranged on a substrate.</p> |
申请公布号 |
DE10346362(A1) |
申请公布日期 |
2005.05.04 |
申请号 |
DE2003146362 |
申请日期 |
2003.09.30 |
申请人 |
SIEMENS AG |
发明人 |
HANSEN, CHRISTIAN;KRUEGER, URSUS;PYRITZ, UWE |
分类号 |
B32B38/10;B32B43/00;H01L39/24;(IPC1-7):H01L39/24;H01L31/18 |
主分类号 |
B32B38/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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