Cover device for components of semiconductor processing chamber fitted around outside edge of semiconductor to be processed and angled downwards in the direction of its outer peripheral edge

摘要

The cover device (1) fits around the peripheral edge of the semiconductor (3) to be processed, with the upper surface (2) of the cover device angled downwards in the direction of the outer peripheral edge (25) of the cover device. The geometry of the inner peripheral edge of the cover device is matched to the geometry of the outer peripheral edge of the semiconductor.