Solder body positioning method for producing electrical contact device, comprises placing bodies in holder and supplying energy to them so that they become detached from holder

摘要

The positioning method comprises the following steps: (a) positioning the solder bodies which are to be connected to at least one electronic component in a desired orientation on a holder (1); (b) positioning the electronic component at a distance from the holder; (c) supplying energy to the bodies so that they become detached from the holder; and (d) allowing the detached bodies to come into contact with pre-selected positions on the electronic component so that they become bonded to the latter. Independent claims are also included for the following: (a) Apparatus for carrying out this method, comprising a holder for the bodies, a fastener device for positioning the electronic component relative to the holder and a means for supplying energy to the bodies; and (b) Electronic component with multiple contact positions, comprising electrically conductive objects (solder bodies) which are positioned relative to the contact positions using a bonding material and which are embedded an identical depth in this material.