Terminal device for contacting semiconductor contact surfaces provided by hollow body of electrically insulating and thermally conductive material with conductive coating applied to both its mantle surfaces

摘要

The terminal device (1a,1b) has a hollow body of a material which is electrically insulating and thermally conductive, provided with an inner mantle surface (3), an outer mantle surface (4) and 2 opposing end faces (5,6), both mantle surfaces provided with an electrically conductive coating and at least one end surface corresponding in shape and size to a semiconductor inner and/or outer contact surface (7,8). An independent claim for a soldering method for contacting the terminal device with the contact surfaces of a semiconductor is also included.