PROCESS FOR PREPARATION OF ALICYCLIC DIEPOXY COMPOUNDS, CURABLE EPOXY RESIN COMPOSITIONS, EPOXY RESIN COMPOSITIONS FOR THE ENCAPSULATION OF ELECTRONIC COMPONENTS, STABILIZERS FOR ELECTRICAL INSULATING OILS, AND CASTING EPOXY RESIN COMPOSITIONS FOR ELECTRICAL INSULATION

摘要

Epoxy resin compositions represented by the general formula (I) or (II), products of curing of the compositions, and a process for the preparation of the epoxy compounds through epoxidation with an organic percarboxylic acid: (I) (II) wherein R 1 to R18 are each independently hydrogen, halogeno, a hydrocarbon group which may contain oxygen or halogen, or optionally substituted alkoxy.