| 摘要 |
Holding device for at least one semiconductor stacking structure (1) comprises a top part (2) connected to a base part (3) via side parts (4, 5). The semiconductor stacking structure is mounted between the top part and base part. The side parts are each arranged a distance away from the semiconductor stacking structure. An independent claim is also included for an electrical system with at least two holding devices arranged next to each other or above each other. Preferred Features: The side parts contain an insulating material. |
