Monitored laser shock peening

摘要

A pulse laser (20) is configured for projecting a pulsed laser beam (22) at a target site (24) on a fluid film (18) atop a workpiece (12) for laser shock peening the workpiece. The fluid film is monitored by a probe laser (36) which projects a probe laser beam (38) at the target site, and an optical detector (40) which detects reflection of the probe beam from the target site. The pulse laser is coordinated by the detector in order to emit the pulsed beam in response to the condition of the monitored film.