发明名称 |
Chemical mechanical polishing apparatus |
摘要 |
A chemical mechanical polishing (CMP) apparatus includes a plate that holds a substrate, a pad assembly unit comprising a pad support device, a positioning device, and a rotation device operatively connected to the pad assembly unit. The pad support device comprises a plurality of support plates to which pad pieces of a polishing pad can be attached. The positioning device can move at least one of the plurality of support plates in a direction along a surface of the semiconductor substrate to be polished. Further, the CMP apparatus can control the polishing amount along any portion of a surface of a wafer to be polished.
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申请公布号 |
US6887130(B2) |
申请公布日期 |
2005.05.03 |
申请号 |
US20040795370 |
申请日期 |
2004.03.08 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE JONG-WON;HONG CHANG-KI;KIM HO-YOUNG |
分类号 |
H01L21/304;B24B37/04;B24B41/04;(IPC1-7):B24B49/00 |
主分类号 |
H01L21/304 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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