发明名称 |
Systems for buried electrical feedthroughs in a glass-silicon MEMS process |
摘要 |
A method for providing conductive paths into a hermetically sealed cavity is described. The sealed cavity is formed utilizing a silicon-glass micro-electromechanical structure (MEMS) process and the method includes forming recesses on a glass substrate everywhere that a conductive path is to pass into the cavity, and forming conductive leads in and around the recesses. A glass layer is deposited over the substrate, into the recesses, and over the conductive leads and then planarized to expose portions of the conductive leads. A sealing surface is formed on at least a portion of the glass layer. Silicon is then bonded to the sealing surface of the planarized glass layer, the wafer being configured such that a portion of each lead is within the sealed cavity and a portion of each lead is outside the sealed cavity.
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申请公布号 |
US6888233(B2) |
申请公布日期 |
2005.05.03 |
申请号 |
US20030385181 |
申请日期 |
2003.03.10 |
申请人 |
HONEYWELL INTERNATIONAL INC. |
发明人 |
HORNING ROBERT D.;RIDLEY JEFFREY A. |
分类号 |
B81B7/00;(IPC1-7):H01L21/00 |
主分类号 |
B81B7/00 |
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