POLYMIDE COPPER CLAD LAMINATIED SUBSTRATE(FCCL) HAVING THE MICRO COPPER LAYER AND METHOD FOR MANUFACTURING RIGID-FLEXIBLE SUBSTRATE USING THE FCCL,申请号KR20030075119-传众专利搜索

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发明名称	POLYMIDE COPPER CLAD LAMINATIED SUBSTRATE(FCCL) HAVING THE MICRO COPPER LAYER AND METHOD FOR MANUFACTURING RIGID-FLEXIBLE SUBSTRATE USING THE FCCL
摘要
申请公布号	KR20050040017(A)	申请公布日期	2005.05.03
申请号	KR20030075119	申请日期	2003.10.27
申请人	SAMSUNG ELECTRO-MECHANICS CO., LTD.	发明人	AN, DONG GI;LEE, BYOUNG HO;LEE, YANG JE;MYOUNG, BUM YOUNG;YANG, DEK GIN
分类号	H05K1/02;(IPC1-7):H05K1/02	主分类号	H05K1/02
代理机构		代理人
主权项
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