发明名称 |
BICMOS technology on SIMOX wafers |
摘要 |
A method and structure for a bipolar transistor comprising a patterned isolation region formed below an upper surface of a semiconductor substrate and a single crystal extrinsic base formed on an upper surface of the isolation region. The single crystal extrinsic base comprises a portion of the semiconductor substrate located between the upper surface of the isolation region and the upper surface of the semiconductor substrate. The bipolar transistor further comprises a single crystal intrinsic base, wherein a portion of the single crystal extrinsic base merges with a portion of the single crystal intrinsic base. The isolation region electrically isolates the extrinsic base from a collector. The intrinsic and extrinsic bases separate the collector from an emitter. The extrinsic base comprises epitaxially-grown silicon. The isolation region comprises an insulator, which comprises oxide, and the isolation region comprises any of a shallow trench isolation region and a deep trench isolation region.
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申请公布号 |
US6888221(B1) |
申请公布日期 |
2005.05.03 |
申请号 |
US20040709114 |
申请日期 |
2004.04.14 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
JOSEPH ALVIN J.;LIU QIZHI;SADANA DEVENDRA K. |
分类号 |
H01L21/331;H01L21/762;H01L29/10;H01L29/732;(IPC1-7):H01L27/082 |
主分类号 |
H01L21/331 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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