发明名称 BICMOS technology on SIMOX wafers
摘要 A method and structure for a bipolar transistor comprising a patterned isolation region formed below an upper surface of a semiconductor substrate and a single crystal extrinsic base formed on an upper surface of the isolation region. The single crystal extrinsic base comprises a portion of the semiconductor substrate located between the upper surface of the isolation region and the upper surface of the semiconductor substrate. The bipolar transistor further comprises a single crystal intrinsic base, wherein a portion of the single crystal extrinsic base merges with a portion of the single crystal intrinsic base. The isolation region electrically isolates the extrinsic base from a collector. The intrinsic and extrinsic bases separate the collector from an emitter. The extrinsic base comprises epitaxially-grown silicon. The isolation region comprises an insulator, which comprises oxide, and the isolation region comprises any of a shallow trench isolation region and a deep trench isolation region.
申请公布号 US6888221(B1) 申请公布日期 2005.05.03
申请号 US20040709114 申请日期 2004.04.14
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 JOSEPH ALVIN J.;LIU QIZHI;SADANA DEVENDRA K.
分类号 H01L21/331;H01L21/762;H01L29/10;H01L29/732;(IPC1-7):H01L27/082 主分类号 H01L21/331
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