| 发明名称 |
BONDING MATERIAL AND BONDING METHOD |
| 摘要 |
<p>There is provided a bonding material and a bonding method which enable lead-free bonding that can replace high- temperature soldering. The bonding material of the present invention comprises a dispersion in an organic solvent of composite metallic nano- particles having such a structure that a metal core of a metal particle having an average particle diameter of not more than 100 nm. The bonding material can be advantageously used in a stepwise bonding process containing at least two bonding steps.</p> |
| 申请公布号 |
KR20050040812(A) |
申请公布日期 |
2005.05.03 |
| 申请号 |
KR20047000955 |
申请日期 |
2004.01.20 |
| 申请人 |
EBARA CORPORATION |
发明人 |
CHIKAMORI, YUSUKE;HIROSE, MASAYOSHI;KAGOSHIMA, KAORI;NAGASAWA, HIROSHI;OGURE, NAOAKI |
| 分类号 |
B22F1/00;B22F7/06;B23K35/02;B23K35/30;B23K35/36;C09J5/06;C09J11/04;H01L21/60;H01L23/482;H05K3/32;(IPC1-7):B22F1/00;H01L23/48 |
主分类号 |
B22F1/00 |
| 代理机构 |
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