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发明名称
半导体晶片封装构造及其制造方法
摘要
一种半导体晶片封装构造,其包含一基板、一半导体晶片固接于该基板上、复数个连接线(bondingwires)将该晶片电性连接于该基板以及一保护件固接于该基板上,使得该半导体晶片以及该连接线系设于该保护件以及该基板之间。本发明之半导体晶片封装构造的每一连接线的整个表面系覆盖有一绝缘薄膜避免该保护件中的导线发生短路。本发明另提供一种制造该半导体晶片封装构造的方法。
申请公布号
TW200515554
申请公布日期
2005.05.01
申请号
TW092128865
申请日期
2003.10.17
申请人
日月光半导体制造股份有限公司
发明人
黄雅铃;林子彬;许宏达
分类号
H01L23/28
主分类号
H01L23/28
代理机构
代理人
花瑞铭
主权项
地址
高雄市楠梓加工出口区经三路26号
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