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发明名称
具有植球面元件保护之球格阵列半导体装置
摘要
一种具有植球面元件保护之球格阵列半导体装置,其包含有一具有一植球面之基板,在该基板之植球面设有复数个焊球、一表面接着元件及一元件保护机构,该元件保护机构系包含有如金属球之复数个支撑元件,该些支撑元件系具有高于该些焊球回焊温度之熔点,且该些支撑元件具有一高于该表面接着元件之支撑高度,以保护在回焊过程该表面接着元件不接触一外电路板。
申请公布号
TW200515515
申请公布日期
2005.05.01
申请号
TW092130582
申请日期
2003.10.31
申请人
日月光半导体制造股份有限公司
发明人
刘昇聪
分类号
H01L21/48
主分类号
H01L21/48
代理机构
代理人
张启威
主权项
地址
高雄市楠梓加工出口区经三路26号
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