发明名称 Förfarande för vakuumdeponering av elekromagnetiskt interferenslager för mobiltelefons ytterhölje och vakuumdeponeringsjigg därför
摘要 A method of vacuum depositing an EMI (Electromagnetic Interference) layer using a vacuum deposition jig for a mobile phone outer case is provided. Here, when an EMI layer is fabricated in a mobile phone outer case which finally surrounds mobile phone inner circuit components in order to shield electromagnetic waves harmful for a human body and generated from a mobile phone, an EMI layer is vacuum deposited in a vacuum deposition unit, using a vacuum deposition jig which exposes only a portion where an EMI layer is to be deposited, and fully surrounds the exposed portion in the outer case. Accordingly, in comparison with an existing method, a remarkable effect of interrupting electromagnetic waves is provided and an inferiority ratio is remarkably reduced.
申请公布号 SE0402613(A) 申请公布日期 2005.05.01
申请号 SE20040002613 申请日期 2004.10.28
申请人 JANG SANG HO 发明人 JANG SANG HO
分类号 C23C14/24;C23C;C23C14/04;C23C14/50;H01R13/658;H04B1/38;H05K9/00;(IPC1-7):H05K9/00 主分类号 C23C14/24
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