| 摘要 |
THIS INVENTION IS TO PROVIDE A PRINTED CIRCUIT BOARD SUITABLE FOR THE HIGH DENSIFICATION OF MOUNTING PARTS USING A SOLDER BUMP AND FOR THE IMPROVEMENTS OF CONNECTION RELIABILITY AND MOUNTING RELIABILITY, AND PROPOSES A PRINTED CIRCUIT BOARD COMPRISING A MOUNTING PAD PROVIDED WITH A SOLDER BUMP BY COVERING A MOUNTING SURFACE WITH A SOLDER RESIST, CHARACTERIZED IN THAT A POSITION OF FORMING THE SOLDER BUMP IS ARRANGED SO AS TO MATCH WITH A POSITION OF A VIAHOLE, OR A SIZE OF OPENING PORTION FORMED IN THE SOLDER RESIST IS MADE LARGER THAN A SIZE OF A LAND THE VIAHOLE SO AS NOT TO OVERLAP THE SOLDER RESIST WITH THE VIAHOLE.
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