Flexible interconnecting substrate, method of manufacturing the same, film carrier, tape-shaped semiconductor device, semiconductor device, circuit board and electronic instrument

摘要

A flexible interconnecting substrate comprises a base substrate of an elongate form and interconnecting patterns formed on the base substrate, where each of the interconnecting patterns has a plurality of interconnects and each of the interconnects has a portion that extends to the right and a portion that extends to the left, with respect to the longitudinal axis of the base substrate. Each interconnecting pattern has narrow portions and that narrow in the widthwise direction of the base substrate and wide portions and that broaden in the widthwise direction of the base substrate.