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发明名称
RAPID THERMAL PROCESSING EQUIPMENT HAVING SENSING CAPACITY OF WAFER WARPAGE
摘要
申请公布号
KR20050039062(A)
申请公布日期
2005.04.29
申请号
KR20030074424
申请日期
2003.10.23
申请人
SAMSUNG ELECTRONICS CO., LTD.
发明人
KIM, DAE WOO;LEE, YONG HWI;SEO, KYOUNG MYOUNG
分类号
H01L21/324;(IPC1-7):H01L21/324
主分类号
H01L21/324
代理机构
代理人
主权项
地址
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