发明名称 |
WAFER BATCH PROCESSING SYSTEM AND METHOD |
摘要 |
A system and method for isothermally distributing a temperature across a semiconductor device. A furnace assembly is provided, which includes a processing tube configured to removably receive a wafer carrier having a full compliment of semiconductor wafers. A heating assembly is provided which can include a resistive heating element positioned to heat air or other gases allowed to enter the process tube. The wafer carrier and heating assembly are vertically raised into a position within the process tube. Once the heating assembly forms a seal with the process tube, the process tube is exhausted and purged of air. Gas is then allowed to flow into the process tube and exchange heat with the heating element. The heated gas circulates through the process tube to convectively raise the temperature of the wafers.
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申请公布号 |
KR20050039837(A) |
申请公布日期 |
2005.04.29 |
申请号 |
KR20057001870 |
申请日期 |
2005.02.01 |
申请人 |
WAFERMASTERS, INCORPORATED |
发明人 |
YOO, WOO SIK |
分类号 |
H01L21/205;C23C16/46;H01L21/00;H01L21/26;H01L21/324;(IPC1-7):H01L21/324 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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