| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting tool for processing an electronic component, a cutting device, and a manufacturing method for the electronic component that can simultaneously perform cutting and grinding, reduce cost by composition of processing procedure, reduce processing time, improve processing accuracy, and grind a complex shape simultaneously with the cutting. SOLUTION: The cutting tool comprises a plurality of cutting blades and a rotary shaft. The plurality of cutting blades 1 and 2 are rotary cutting blades that are formed in a disk shape and perform the cutting on the circumference, and the center is combined with the rotary shaft on the same axis. At least one cutting blade 1 of the plurality of cutting blades is formed to have a diameter larger than the other cutting blade. COPYRIGHT: (C)2005,JPO&NCIPI
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