| 发明名称 |
Semiconductor device, LED print head and image-forming apparatus using same, and method of manufacturing semiconductor device |
| 摘要 |
In a method of manufacturing a semiconductor thin film piece device, a plurality of semiconductor thin film pieces ( 14 ) are selected from among the semiconductor thin film pieces ( 14 ) formed on a first substrate ( 35 ), and bonded to a first set of predetermined area on a second substrate ( 12 ). Subsequently, a plurality of semiconductor thin film pieces are selected from the remaining semiconductor thin film pieces ( 14 ), and bonded to a second set of predetermined area.
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| 申请公布号 |
US2005087743(A1) |
申请公布日期 |
2005.04.28 |
| 申请号 |
US20040970637 |
申请日期 |
2004.10.21 |
| 申请人 |
OKI DATA CORPORATION |
发明人 |
OGIHARA MITSUHIKO;FUJIWARA HIROYUKI;ABIKO ICHIMATSU;SAKUTA MASAAKI |
| 分类号 |
B41J2/45;H01L21/48;H01L21/50;H01L21/60;H01L21/98;H01L25/075;H01L33/44;H01L33/48;H01L33/58;(IPC1-7):H01L29/04 |
主分类号 |
B41J2/45 |
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