| 发明名称 |
System for rinsing and drying semiconductor substrates and method therefor |
| 摘要 |
A system and method for cleaning and drying semiconductor wafers improves device yield by providing more advanced control of the ratio of drying fluid to cleaning fluid, for example the ratio of N<SUB>2 </SUB>vapor to IPA vapor. In addition, a quick drain process is employed to improve process throughput, and to further improve particle and watermark removal during the cleaning and drying steps.
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| 申请公布号 |
US2005087211(A1) |
申请公布日期 |
2005.04.28 |
| 申请号 |
US20040796507 |
申请日期 |
2004.03.09 |
| 申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
PARK KI HWAN;SONG JONG KOOK;CHO MO HYUN;CHO SUNG-HO;LEE SUN JAE;LIM PYUNG HO;CHO DONG WOOK |
| 分类号 |
H01L21/304;B08B3/12;B08B6/00;H01L21/00;H01L21/306;(IPC1-7):B08B3/12 |
主分类号 |
H01L21/304 |
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