发明名称 Bump structure of a scattering reflective board and method for manufacturing the bump structure
摘要 A bump structure of a scattering reflective board and a method for manufacturing the bump structure. Multiple strip-shaped shielding sections are arranged on an optical mask at intervals. Multiple irregularly arranged circular holes are distributed in the respective strip-shaped shielding sections. Multiple irregularly arranged circular shielding sections are distributed in spacing sections between the adjacent strip-shaped shielding sections. Multiple irregularly arranged arch notches and arch shielding sections are distributed on the edges of the strip-shaped shielding sections. After exposed and developed, multiple scattered and irregularly arranged bumps are formed on the photosensitive material layer laid on the substrate. Then a reflective film is laid on the substrate and the bumps to form the reflective board.
申请公布号 US2005088592(A1) 申请公布日期 2005.04.28
申请号 US20040989376 申请日期 2004.11.17
申请人 CHEN YI F. 发明人 CHEN YI F.
分类号 G02F1/1335;G03F1/14;(IPC1-7):G02F1/133 主分类号 G02F1/1335
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