发明名称 SUBSTRATE HEATER ASSEMBLY
摘要 A substrate heater assembly for supporting a substrate of a predetermined standardized diameter during processing is provided. In one embodiment, the substrate heater assembly includes a body having an upper surface, a lower surface and an embedded heating element. A substrate support surface is formed in the upper surface of the body and defines a portion of a substrate receiving pocket. An annular wall is oriented perpendicular to the upper surface and has a length of at least one half a thickness of the substrate. The wall bounds an outer perimeter of the substrate receiving pocket and has a diameter less than about 0.5 mm greater than the predetermined substrate diameter.
申请公布号 WO2005038081(A2) 申请公布日期 2005.04.28
申请号 WO2004US32534 申请日期 2004.10.04
申请人 APPLIED MATERIALS, INC.;FODOR, MARK, A.;VELASTEGUI, SOPHIA, M.;SEN, SOOVO;SIVARAMAKRISHNAN, VISWESWAREN;LEE, PETER, WAI-MAN;SILVETTI, MARIO, DAVID 发明人 FODOR, MARK, A.;VELASTEGUI, SOPHIA, M.;SEN, SOOVO;SIVARAMAKRISHNAN, VISWESWAREN;LEE, PETER, WAI-MAN;SILVETTI, MARIO, DAVID
分类号 C23C16/458;C23C16/46;H01L21/687 主分类号 C23C16/458
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