发明名称 METHOD FOR MANUFACTURING TRANSISTOR
摘要 <p>Using TDEAH as the source gas of hafnium, TDMAS as the source gas of silicon and an oxygen gas as the oxygen supply source, hafnium silicate is deposited on a major surface of a silicon substrate (101) by a chemical vapor deposition method under a process pressure of 100Pa, thereby forming an insulating film (102). Deposition is continued while changing the process pressure to a relatively high pressure of 800 Pa, thereby forming a gate insulating film (103).</p>
申请公布号 WO2005038928(A1) 申请公布日期 2005.04.28
申请号 WO2004JP15018 申请日期 2004.10.12
申请人 TOKYO ELECTRON LIMITED;NAKAMURA, GENJI;SUGAWARA, TAKUYA;MIYATANI, KOTARO;SHIMOMURA, KOUJI 发明人 SUGAWARA, TAKUYA;MIYATANI, KOTARO;SHIMOMURA, KOUJI;NAKAMURA, GENJI
分类号 H01L21/28;C23C16/40;H01L21/316;H01L21/318;H01L21/8238;H01L27/092;H01L29/423;H01L29/49;H01L29/51;H01L29/78;(IPC1-7):H01L29/78;H01L21/336 主分类号 H01L21/28
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