发明名称 |
PLATING DEVICE, PLATING LIQUID EVALUATION DEVICE, METHOD OF OPERATING PLATING LIQUID, AND EVALUATION METHOD FOR PLATING LIQUID |
摘要 |
PROBLEM TO BE SOLVED: To provide a plating device capable of evaluating the deteriorated condition of a plating liquid at high precision before a gold colloid caused by disproportionation reaction is produced in the liquid. SOLUTION: The plating device is provided with: a plating treatment tank 1 to be charged with a plating liquid comprising a gold sulfite complex; a plating liquid replacement means for replacing the plating treatment tank 1 with a plating liquid; and a plating liquid analysis means 5 for sampling the plating liquid from the plating treatment tank 1 or the plating liquid replacing means and analyzing the same. The plating liquid analysis means 5 is provided with: an ultraviolet light source; a cell for securing the ultraviolet light path of the plating liquid; a measurement means for measuring the absorbing properties of ultraviolet rays including a wavelength of 220 to 240 nm; and an evaluation means for evaluating the deteriorated condition of the plating liquid from the measured absorbing properties in a wavelength of 220 to 240 nm. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005113239(A) |
申请公布日期 |
2005.04.28 |
申请号 |
JP20030351137 |
申请日期 |
2003.10.09 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
FUJINO NAOHIKO;KINUGAWA MASARU |
分类号 |
G01N21/33;C25D3/48;C25D21/14;(IPC1-7):C25D21/14 |
主分类号 |
G01N21/33 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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