发明名称 PLATING DEVICE, PLATING LIQUID EVALUATION DEVICE, METHOD OF OPERATING PLATING LIQUID, AND EVALUATION METHOD FOR PLATING LIQUID
摘要 PROBLEM TO BE SOLVED: To provide a plating device capable of evaluating the deteriorated condition of a plating liquid at high precision before a gold colloid caused by disproportionation reaction is produced in the liquid. SOLUTION: The plating device is provided with: a plating treatment tank 1 to be charged with a plating liquid comprising a gold sulfite complex; a plating liquid replacement means for replacing the plating treatment tank 1 with a plating liquid; and a plating liquid analysis means 5 for sampling the plating liquid from the plating treatment tank 1 or the plating liquid replacing means and analyzing the same. The plating liquid analysis means 5 is provided with: an ultraviolet light source; a cell for securing the ultraviolet light path of the plating liquid; a measurement means for measuring the absorbing properties of ultraviolet rays including a wavelength of 220 to 240 nm; and an evaluation means for evaluating the deteriorated condition of the plating liquid from the measured absorbing properties in a wavelength of 220 to 240 nm. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005113239(A) 申请公布日期 2005.04.28
申请号 JP20030351137 申请日期 2003.10.09
申请人 MITSUBISHI ELECTRIC CORP 发明人 FUJINO NAOHIKO;KINUGAWA MASARU
分类号 G01N21/33;C25D3/48;C25D21/14;(IPC1-7):C25D21/14 主分类号 G01N21/33
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