MULTI-LAYER CERAMIC SUBSTRATE, METHOD FOR MANUFACTURNG THE SAME AND ELECTRONIC DEVICE USING THE SAME

摘要

A multi-layer ceramic substrate which is manufactured by (a) preparing a green sheet for a substrate capable of sintering at a low temperature by the use of a powder of a ceramic material and an organic binder, (b) forming an electrode on the green sheet for a substrate, followed by lamination, to prepare a non-sintered multi-layer ceramic substrate, (c) providing one or two constraining layers containing inorganic particles which does not sinter at the sintering temperature for the non-sintered multi-layer ceramic substrate (having an average particle diameter being 0.3 mum or more and 0.3 to 4 times the average particle size of the above ceramic material powder) and an organic binder so that they contact closely with the upper surface and/or under surface of the non-sintered multi-layer ceramic substrate containing an external electrode, followed by converting them to an integrated laminate, (d) sintering the laminate and (e) removing the constraining layers from the surfaces of the sintered laminate, characterized in that it exhibits an in-plane shrinkage ratio of 1 % or less (a scatter of 0.1 % or less) and the amount of the above inorganic particles remaining on the above external electrode is 20 mass % or less in terms of the percentage of the metal constituting the above inorganic particles to the sum of the metal constituting the above external electrode and the metal constituting the above inorganic particles.