| 摘要 |
<p>Disclosed is an epoxy resin composition for sealing semiconductors which is characterized by containing (A) an epoxy resin, (B) a phenol resin, (C) a curing accelerator, (D) an inorganic filler and (E) a triazole compound. The epoxy resin composition for sealing semiconductors preferably contains a triazole compound which is represented by the following general formula (1); (wherein R1 represents a hydrogen atom, or a mercapto group, an amino group, a hydroxyl group or a hydrocarbon chain with 1-8 carbon atoms having such a functional group at the end.)</p> |
