| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable an electronic device where an electronic part is mounted on a wiring board to be reduced in thickness and to be restrained from increasing in manufacturing cost. <P>SOLUTION: The electronic device is equipped with the wiring board where a conductor pattern is formed on its first main surface, the chip-shaped electronic part mounted on the first main surface of the wiring board, and connection conductors which electrically connect the conductor pattern formed on the wiring board to the electrodes of the chip-shaped electronic part. Openings are provided to the insulating board leaving opening ends on its first main surface and rear surface (hereafter referred to as a second main surface), the opening ends on the first main surface are stopped up with the conductor pattern, and the openings are filled up with conductive members formed of one of copper, nickel, gold, silver, tin, their alloys and conductive paste. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
