| 摘要 |
PROBLEM TO BE SOLVED: To excellently rotate wafers even when the wafers inside a wafer carrier are sucked to one another during treatment at the time of the alkali etching treatment of semiconductor wafers. SOLUTION: While treating a plurality of the wafers 3 loaded on the wafer carrier 1 inside an etching bath 7, a plurality of rollers 5a, 5b and 5c are pressed around the wafers 3, and the wafers 3 are forcibly rotated by a driving roller 5a in a state of securing a strong friction force between the wafers 3 and the rollers 5a, 5b and 5c. Or, by widening an interval between the plurality of wafers 3 housed in the wafer carrier 1, a suction force between the wafers 3 is weakened and rotation defects of the wafers 3 are prevented. COPYRIGHT: (C)2005,JPO&NCIPI |
