| 摘要 |
PROBLEM TO BE SOLVED: To form an aperture exposing a PAD (pad) in one process and to reliably measure the contact resistance by specifying the vertical position of the PAD, a contact hole or the like in an inspection element formation region. SOLUTION: The substrate is equipped with: a plurality of film layers in each of which a film pattern is to be formed; interlayer films each formed between the plurality of film layers above described; an inspection element pattern T5 which is formed in the inspection element formation region and which comprises the same material as the film pattern in at least one film layer of the plurality of film layers; apertures 114, 115 which are formed in the inspection element formation region in the flattened uppermost interlayer film and which expose a pair of pads 111, 112 to be connected to the above inspection element pattern; and dummy patterns D2, D4 which are formed below the pair of pads 111, 112, respectively, and which comprise the same material as the film pattern in a specified film layer of the plurality of film layers. COPYRIGHT: (C)2005,JPO&NCIPI |
