| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition having high flexibility, forming a thin film and affording a cured product thereof having excellent heat resistance. SOLUTION: For a (brominated) bisphenol A type epoxy resin or a (brominated) bisphenol F type epoxy resin having≥400 g/equivalent epoxy equivalent, a novolak type resin of phenols having 130-200°C softening point is used as a curing agent. COPYRIGHT: (C)2005,JPO&NCIPI |
