发明名称 METHOD FOR MOUNTING ELECTRONIC PART
摘要 PROBLEM TO BE SOLVED: To provide a method for mounting an electronic part by which electrodes of more compact and integrated electronic parts can be surely and reliably connected with each other. SOLUTION: The method for mounting an electronic part is used to connect the electrodes of two electronic parts with each other while they are heated and pressurized, by using a conductive adhesive agent wherein conductive particles that a number of refined magnetic metallic particles are linearly connected are dispersed in an adhesive agent made of an insulating resin and a hardener. In this case, the electrodes are connected with each other while a magnetic field of 10 mT or more is applied in the facing direction to the electrodes. An anisotropical conductive film may be used instead of the conductive adhesive agent. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005116718(A) 申请公布日期 2005.04.28
申请号 JP20030347832 申请日期 2003.10.07
申请人 SUMITOMO ELECTRIC IND LTD 发明人 YAMAMOTO MASAMICHI;KASHIWABARA HIDEKI;TOSHIOKA HIDEAKI
分类号 H05K3/32;(IPC1-7):H05K3/32 主分类号 H05K3/32
代理机构 代理人
主权项
地址
您可能感兴趣的专利