发明名称 |
METHOD FOR MOUNTING ELECTRONIC PART |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for mounting an electronic part by which electrodes of more compact and integrated electronic parts can be surely and reliably connected with each other. SOLUTION: The method for mounting an electronic part is used to connect the electrodes of two electronic parts with each other while they are heated and pressurized, by using a conductive adhesive agent wherein conductive particles that a number of refined magnetic metallic particles are linearly connected are dispersed in an adhesive agent made of an insulating resin and a hardener. In this case, the electrodes are connected with each other while a magnetic field of 10 mT or more is applied in the facing direction to the electrodes. An anisotropical conductive film may be used instead of the conductive adhesive agent. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2005116718(A) |
申请公布日期 |
2005.04.28 |
申请号 |
JP20030347832 |
申请日期 |
2003.10.07 |
申请人 |
SUMITOMO ELECTRIC IND LTD |
发明人 |
YAMAMOTO MASAMICHI;KASHIWABARA HIDEKI;TOSHIOKA HIDEAKI |
分类号 |
H05K3/32;(IPC1-7):H05K3/32 |
主分类号 |
H05K3/32 |
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