发明名称 PLASMA PROCESSING APPARATUS
摘要 PROBLEM TO BE SOLVED: To perform deposition with a high gas dissociation efficiency by realizing a high quality film even at a low temperature of a substrate to be processed. SOLUTION: A plasma discharge generating unit for a plasma processing apparatus is equipped with a plurality of insulating units 3 extending into a direction parallel to the substrate to be processed with the shape of stripes, cathode electrodes 2a provided between at least mutually neighboring insulating units 3, and anode electrodes 2b provided at the end of the side of substrate 4 to be processed in respective insulating units 3. In this case, a plurality of gas introducing ports 6 formed in the cathode electrodes 2a are provided while being arrayed in a direction intersecting with the lengthwise direction of the insulating units 3 having the shape of stripes. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005116740(A) 申请公布日期 2005.04.28
申请号 JP20030348306 申请日期 2003.10.07
申请人 SHARP CORP 发明人 MIYAZAKI ATSUSHI
分类号 C23C16/455;C23C16/509;H01L21/3065;H01L21/31;(IPC1-7):H01L21/31;H01L21/306 主分类号 C23C16/455
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