发明名称 Heat sink with integrated electronics
摘要 A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.
申请公布号 US2005088824(A1) 申请公布日期 2005.04.28
申请号 US20040994538 申请日期 2004.11.22
申请人 DELPHI TECHNOLOGIES, INC. 发明人 BUEHLER DAVID P.;LAWLYES DANIEL A.
分类号 H01L23/42;H01L25/18;(IPC1-7):H05K7/20 主分类号 H01L23/42
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