发明名称 |
Heat sink with integrated electronics |
摘要 |
A heat sink with integrated electronics having a cavity with one or more facing sides. Hybrid circuits are housed in the cavities. A bottom portion seals the housing and has a row of pins is provided for interconnecting the circuits housed in the separate cavities to an external device, thereby allowing the integration of different types of circuits in a single, fully enclosed, yet partitioned, housing.
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申请公布号 |
US2005088824(A1) |
申请公布日期 |
2005.04.28 |
申请号 |
US20040994538 |
申请日期 |
2004.11.22 |
申请人 |
DELPHI TECHNOLOGIES, INC. |
发明人 |
BUEHLER DAVID P.;LAWLYES DANIEL A. |
分类号 |
H01L23/42;H01L25/18;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/42 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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