| 摘要 |
A heat dissipating device is adapted to remove heat from an electronic package. The heat dissipating device includes a heat sink ( 6 ), a fan ( 1 ) and a fan holder ( 2 ). The fan holder comprises a guiding receptacle ( 20 ) and a securing base ( 40 ) covering the heat sink. An inlet ( 24 ) of the guiding receptacle is coupled to the bottom of the fan. An opening ( 221 ) is defined in the guiding receptacle for providing airflow access from the fan to the heat sink.
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