| 摘要 |
An electronic package comprises a substrate (120), an electronic device (110) mounted on the substrate (120), and a stiffener (140) having a central hole (144) on top of the electronic device (110). The electronic device (110) has bond pads (112) connected to respective bond fingers (120) on the substrate (120) by bond wires (130). The stiffener (140)and the substrate (120) together define a space (150) that houses the chip (110) and the bond wires (130). A molding compound (160) fills the space and covers the stiffener. A method of forming the electronic package comprises: providing the substrate (120) bonding the electronic device (110) to the substrate; placing a stiffener (140) on the substrate (120) so that the stiffener (140) and the substrate (120) define a space (150) for housing the electronic device (110); and injecting a molding compound (160) into a central hole (144) of the stiffener (140), the molding compound (160) filling the space (150) and overflowing out of the (144) hole to cover the stiffener (140). |
