Solderfill for semiconductor package assembly and manufacturing method the same,申请号KR20020057331-传众专利搜索

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发明名称	Solderfill for semiconductor package assembly and manufacturing method the same
摘要
申请公布号	KR100484889(B1)	申请公布日期	2005.04.28
申请号	KR20020057331	申请日期	2002.09.19
申请人		发明人
分类号	H01L21/56;(IPC1-7):H01L21/56	主分类号	H01L21/56
代理机构		代理人
主权项
地址

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