| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the reliability of a semiconductor device which is constituted by bonding heatsinks to both the element forming and nonforming surface sides of a semiconductor chip and molding almost whole body of the device with a resin, with respect to the fracture of a joint caused by a thermal stress. <P>SOLUTION: The semiconductor device comprises a semiconductor chip 10, an upper heatsink 30 bonded to the element forming surface 11 side of the chip 10 with a bonding material 50, and a lower heatsink 30 bonded to the element nonforming surface 12 side of the chip 10 with the bonding material 50 and constituted by molding almost whole body of the semiconductor device with a resin 60. The coefficients of linear expansion α2 and α1 of the heatsinks 20 and 30 and resin 60 are adjusted to meet the relation of 0.8α2≤α1≤1.5α2. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
