| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor manufacturing apparatus and a semiconductor manufacturing method, capable of controlling a flow of each purge gas with high accuracy, in a method of delivering a trace of the purge gases to pipes of process gasses connected to a processing package and quickly replacing the gases in the pipes. SOLUTION: Cut-off valves V1 to V4 are provided to a stage immediately in front of the processing package 1 in each of inlet pipes 13 to 16, a purge gas shunt path 51 with an orifice 53 called a sonic noise or the like provided thereto is connected between the processing package 1 and the cut-off valves V1 to V4, the pressure at the primary side of the orifice is controlled to be twice or over the pressure at the secondary so as to supply the purge gas to each inlet pipe with an equal rate of flow at all times, and a mass flow controller 52, provided to the main stream 50 of a purge gas bypass channel 51, controls the total flow rate of the purge gas. COPYRIGHT: (C)2005,JPO&NCIPI
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